XTPL
3D Printed Chip Packaging Specialist XTPL Enters Japanese Market
The additive manufacturing (AM) industry naturally wants to move beyond prototyping to production at scale, and the industry is certainly starting to demonstrate success with that objective, especially in Asia….
3D Printing Financials: XTPL Adds New Semiconductor and Defense Customers in Q1 2026
Polish microprinting company XTPL (WSE: XTP) reported first-quarter 2026 revenue of PLN 1.6 million (roughly $441,000) as the company expands into the semiconductor and advanced electronics markets, while also launching…
Microprinting Microcap XTPL Reports 2025 Sales Growth Despite Net Loss
The Polish company XTPL is among a category of small startups sitting at the overlap between additive manufacturing (AM) and advanced packaging for the semiconductor industry. 3DPrint.com’s Vanesa Listek wrote…
XTPL Sells First ODRA System to Silicon Valley Semiconductor Packaging Client
One prerequisite for success in additive manufacturing (AM) is the establishment of a proven system for converting initial sales used as tech validation into future sales of higher-value hardware that’s…
XTPL’s 3D Printed Advanced Packaging Solution Lands the Company a Strategic Partnership with Leading Semicap OEM
Chip packaging refers to all parts of a semiconductor device aside from the die (the “chip”) itself. As this IBM explainer nicely puts it, “In a nutshell, chip packaging provides…
Is XTPL the Microscale Maverick of Electronics 3D Printing?
Polish company XTPL‘s (WSE: XTP) micro-scale printing is keeping the edge in electronics and high-tech applications. At its core, XTPL’s patented 3D printers create ultra-fine conductive patterns for microelectronics, semiconductors,…
