tag/semiconductor-packaging

semiconductor packaging

3D Printed Electronics Specialist APES Joins Great Lakes Semiconductor’s First Innovation Funnel Project

Since Great Lakes Semiconductor (GLS) and Advanced Printed Electronic Solutions (APES) announced a strategic partnership earlier this year, I’ve been looking forward to hearing more about the collaboration, which the…

3D Printing Financials: XTPL Adds New Semiconductor and Defense Customers in Q1 2026

Polish microprinting company XTPL (WSE: XTP) reported first-quarter 2026 revenue of PLN 1.6 million (roughly $441,000) as the company expands into the semiconductor and advanced electronics markets, while also launching…

Australia’s AMCRC Lands AU$11M to Support First Five CORE Projects

The Australian government launched the Additive Manufacturing Cooperative Research Centre (AMCRC) last year with a commitment of nearly AU$60 million (~$40 million) in public funding, with the AMCRC’s partners from…

XTPL Sells First ODRA System to Silicon Valley Semiconductor Packaging Client

One prerequisite for success in additive manufacturing (AM) is the establishment of a proven system for converting initial sales used as tech validation into future sales of higher-value hardware that’s…

Electroninks’ “World-First” Copper Ink Opens Up New Potential for 3D Printed Electronics

Electroninks, the Austin-based manufacturer of metal organic decomposition (MOD) inks for additive manufacturing (AM) and semiconductor packaging, has introduced what the company claims is the “world’s first” commercially available copper…

Scrona and Electroninks Collaborate to Advance Semiconductor Packaging Innovation

Inkjet developer Scrona and conductive ink maker Electroninks are collaborating to advance semiconductor packaging. Electroninks produces silver, platinum, gold, and copper inks, which are non-toxic metal-organic decomposition (MOD) inks known…

Scrona Rolls out GEN3 Printhead for High-Precision Manufacturing, Raises $4 Million

ETH Zurich spin-off Scrona has raised $4 million through Convertible Loan Agreement (CLA) financing, bringing its total funding to $15.2 million. Known for its advanced technology that can create tiny,…

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Biden’s Plan for National Semiconductor Technology Center is a Treasure Trove of 3D Printing Opportunities

Whether the Biden administration’s CHIPS Act will truly succeed at transforming American manufacturing is a question that can only be answered years from now. Nevertheless, it is already clear that…