chiplet technology
XTPL’s 3D Printed Advanced Packaging Solution Lands the Company a Strategic Partnership with Leading Semicap OEM
Chip packaging refers to all parts of a semiconductor device aside from the die (the “chip”) itself. As this IBM explainer nicely puts it, “In a nutshell, chip packaging provides…
APES Partners with Great Lakes Semiconductor to Scale Advanced, Additive Chip Packaging
Terminologically, additively manufactured electronics (AME) occupies similar space in the realm of tiny components that additive construction (AC) occupies when it comes to large components: it’s a single phrase that…
Siemens in Talks to Acquire Altair Engineering: Implications for 3D Printing and Advanced Manufacturing
Siemens AG is reportedly in discussions to acquire Altair Engineering Inc., in what could be a landmark acquisition for the German engineering giant. Sources indicate that Siemens is working with…
