ultra-precise dispensing
3D Printed Packaging OEM XTPL Adds Another Japanese Customer
These things can change at any moment nowadays, but the biggest economic story of the year might not be elevated energy prices, after all. Elevated prices for memory chips may…
3D Printed Chip Packaging Specialist XTPL Enters Japanese Market
The additive manufacturing (AM) industry naturally wants to move beyond prototyping to production at scale, and the industry is certainly starting to demonstrate success with that objective, especially in Asia….
XTPL’s 3D Printed Advanced Packaging Solution Lands the Company a Strategic Partnership with Leading Semicap OEM
Chip packaging refers to all parts of a semiconductor device aside from the die (the “chip”) itself. As this IBM explainer nicely puts it, “In a nutshell, chip packaging provides…
