semiconductor capital equipment
Melotte Partners with amsight and Additive Center to Reduce CT Scanning for 3D Printed Semicap Parts
The first report for Additive Manufacturing Research (AMR) that I wrote solo was about the AM market opportunity in semiconductor capital equipment (semicap) components. Published in early 2024, the report…
XTPL’s 3D Printed Advanced Packaging Solution Lands the Company a Strategic Partnership with Leading Semicap OEM
Chip packaging refers to all parts of a semiconductor device aside from the die (the “chip”) itself. As this IBM explainer nicely puts it, “In a nutshell, chip packaging provides…
Titomic Lands First Order for 3D Printed Semiconductor Capital Equipment Components
One of the markets that should be a reliable source of growth well into the future for the additive manufacturing (AM) industry is semiconductor capital equipment (semicap). When Additive Manufacturing…
