electronics packaging
3D Printed Packaging OEM XTPL Adds Another Japanese Customer
These things can change at any moment nowadays, but the biggest economic story of the year might not be elevated energy prices, after all. Elevated prices for memory chips may…
Researchers Develop Shape Memory PLA Filament with Mussels and Wheat
Mohammadreza Lalegani Dezaki, Callum Branfoot, Jon Baxendale, and Mahdi Bodaghi from Nottingham Trent University and the UK’s National Composites Centre have conducted fascinating research on PLA. The team developed composites…
ESA Funds Horizon Microtechnologies’ Metallized 3D Printed Electronics Parts
German small-scale manufacturing expert Horizon Microtechnologies has received the European Space Agency (ESA)’s Spark funding to apply its specialty metallization technology to space applications. The firm believes its parts can…
