Texas Instruments Releases New Chipsets for DLP SLA 3D Printing, Offers Superior Resolution, Speed & Affordability
Powerful. Efficient. These are two adjectives often associated with new products enticing us to buy something new in 3D printing. You may be surprised though–and impressed–to discover that that these qualities are also attached to Texas Instruments, and a 3D printing chip coming down the pike from none other than Texas Instruments. A sleeper within the industry, they have been producing chipsets for DLP technology in SLA 3D printers for a while now. We followed them regarding releases of previous chipsets for 3D printing which were making an impact in the 3D printing industry.
With the chipsets already in their lineup, the DLP Products division of TI is working to make the growing popularity in the 3D printing of circuit boards an even more successful and streamlined exercise, allowing for unique electronics patterns and solder masks. As is usually the case with 3D printing in offering not only great innovation, but also improvement, manufacturers and users are able to enjoy a better process all around with better efficiently and significantly greater affordability.
Now, the Dallas-based company is announcing the release of a new chip even more stunning than the last in what it will be able to do for those involved in using DLP technology for SLA 3D printers.
The DLP9500UV chipset will be claiming its fame as the highest resolution ultraviolet DLP chip available for curing images. With over two million micro-mirrors, large exposure areas can be covered with print sizes near 1µm covered.
“Adding the DLP9500UV to the TI DLP portfolio allows the chipset to be accessible and available to developers,” states the TI team.
This chipset is also combined with the following:
- DLPC410 Digital Controller
- DLPR410 Configuration PROM
- DLPA200 DMD Micromirror Driver
Intended for industrial and medical imaging use, TI foresees it also being used for processes in:
- Direct imaging lithography
- 3D printing
- Laser marking
- Hyperspectral imaging
DLP Products will also be releasing another chipset this fall. The DLP7000UV will be made available to developers. Both the DLP9500UV and DLP7000UV are responsible for offering:
- High resolution
- Fast-pattern switching speed
- Exposure in the 363 – 420 nm wavelengths
- Low thermal resistance
- High optical power up to up to 2.5W/cm²
- Package window made for UV wavelength transmission
The DLP7000UV chipset will be emerging as the most rapid-speed UV DLP chip on the market, and is targeted to offer affordability to at the mid-range platform. Texas Instruments recommends the DLP9500UV chipset for those who require a higher resolution and are in need of faster production cycle times. This new chipset offers pixel loading speed of up to 48Gps.
How do you see these chipsets changing the face of SLA 3D printing with DLP technology? Are you surprised to see Texas Instruments in the game? Discuss in the Two New Texas Instruments DLP SLA 3D Chipsets forum thread over at 3DPB.com.
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