3DPOD Episode 72: Metal AM Applications with Julien Cohen, 3DEO
Julien Cohen worked for Stratasys Direct and Eaton in Application Development before joining 3DEO. He takes us through what application engineering is and how it helps customers. We also have a lively discussion about the relative merits of various technologies and approaches. Additionally, he explains 3DEO’s unique binder jetting technology and how the company is using it for serial production in 3D printing. We talk about future scenarios in manufacturing and what will power the 3D printing. A lovely conversation and we hope that you enjoy it as well.
Podcast (podcast-audio): Play in new window | Download
Subscribe to Our Email Newsletter
Stay up-to-date on all the latest news from the 3D printing industry and receive information and offers from third party vendors.
Print Services
Upload your 3D Models and get them printed quickly and efficiently.
You May Also Like
ASTM International Works with UK MoD on America Makes Project
The UK Ministry of Defense (MoD) will work with ASTM International on a $1.1 million project to let it work in closer concert with the US Department of War (DoW)....
UK Government Funds Research to Develop 3D Printed Metal Alloys for Nuclear Fusion
The UK Atomic Energy Authority (UKAEA), a government-funded research organization, has demonstrated a persistent interest in developing metal additive manufacturing (AM) materials for nuclear fusion applications, including multiple phases of...
Top 10 3DPrint.com Stories of 2025: Kickstarter, Consumer Goods, Bankruptcy, & More
As Vanesa Listek wrote, last year was a major turning point for additive manufacturing (AM), as the industry is working to sort itself out. Customers want proven use cases and...
3D Printing Predictions 2026: Industrial Production & Polymer Additive Manufacturing
Polymer additive manufacturing is seeing less investment, attention, and disruption than metal additive manufacturing currently. Less crucial for defense needs, it has of late had far fewer new entrants. But,...
