AMS Spring 2023

Amkor Technology to Utilize Orbotech Inkjet 600 for System-in-Package Applications

Inkbit

Share this Article

orbotech logoWith decades of experience dealing with the global electronics manufacturing industry, Israel-based technology and solutions provider Orbotech has become an integral part of the electronics 3D printing movement, an expansively growing and increasingly vital industry. A couple of months ago, Orbotech unveiled their Precise 800 Automated Optical Shaping (AOS) System at the Suzhou, China-based exhibition CTEX 2016. This system will aim to conquer advanced high density interconnect (HDI) and complex multi-layer PCB manufacturing, using their proprietary technology to offer this unique solution.

Now, it seems like major enterprises are starting to take notice of what companies like Orbotech have to offer. Recently, Amkor Technology, Inc., a leading provider of semiconductor packaging and test services based in Tempe, Arizona, decided that they would begin utilizing the Orbotech Inkjet 600 3D printing system to print high aspect ratio, 3D underfill dams for new system-in-package (SiP) products. SiP corresponds to the number of integrated circuits enclosed in a single module, and by laying out this electronic groundwork via 3D printing technology, components can be mapped in an extremely compact way.

“Amkor’s use of Orbotech Inkjet 600 for 3D printing is a significant implementation of process innovation in high-volume semiconductor packaging. We are experiencing a great deal of interest in inkjet printing from the packaging industry, for applications ranging from underfill dams to package marking to the direct printing of isolation layers. We believe that this may be the beginning of an industry trend towards adopting additive manufacturing solutions for seamless production processes,” said Kevin Crofton, President of SPTS and Corporate Vice President at Orbotech.

The Orbotech Inkjet 600

The Orbotech Inkjet 600

By integrating Orbotech’s technology into their business model, Amkor hopes to maximize its manufacturing flexibility, increase its feature position accuracy, and also reduce its design-to-manufacturing lifecycle. By utilizing the Inkjet 600 3D printer to create underfill dams, which are used prevent leakage between active and passive components, Amkor hopes to enable the formation of tall underfill dams in one single process. In order to implement a tighter integration of components, the company will use Orbotech’s technology for real-time local alignment correction, ensuring that every component is ideally situated.

“Amkor’s emphasis is on functional integration and size reduction by using different package and interconnect technologies for System-in-Package offerings. By investing in solutions such as Orbotech Inkjet 600 for printing of underfill dams as opposed to conventional methods, we enable higher levels of integration in smaller form factors for our customers,” commented Amkor’s R&D Vice President in South Korea, JuHoon Yoon.

amkorlogoNot only will the Orbotech Inkjet 600 cut production time by eliminating the need for subtractive manufacturing process, it will also help Amkor drive down their production costs as well. This latest integration of electronics 3D printing by Amkor shows the undeniable rise of additive manufacturing as a tool for manufacturing electronic products. Orbotech will be exhibiting their technology alongside their subsidiary company, called SPTS Technologies, at SEMICON West, which takes place from July 12-14 in San Francisco. For those on the West Coast planning to attend the upcoming conference and exhibition, you can find Orbotech at Booth No. 1417 in the South Hall. Discuss further over in the Amkor to Begin Using Orbotech Inkjet 600 3D Printing System forum over at 3DPB.com.

Share this Article


Recent News

Startup to 3D Print Data Centers Using $7M in Funding

All-Female Vehicle Builds and International Trade Anchor Women in 3D Printing Conference in Dreams and Reality



Categories

3D Design

3D Printed Art

3D Printed Food

3D Printed Guns


You May Also Like

3D Printing Webinar and Event Roundup: January 22, 2023

For this weekend’s roundup, the TIPE 3D Printing Conference kicks things off with its third iteration on Tuesday, and ASTM International will hold an AM construction workshop. There will also...

Featured

Learn About 3D Printing at Wi3DP’s Third TIPE Conference

After a year in which many businesses learned to navigate new challenges and risks, 2022 taught many in the 3D printing industry how to better prepare for the future. With...

Sponsored

Digitalization and Additive Manufacturing: Leveraging the Real and Digital Worlds

Additive Manufacturing, or industrial 3D printing, has evolved from prototyping with basic materials and equipment to producing low tolerance components with limited use to additive manufacturing as we know it...

AMS to Bring Unique Networking to 3D Printing Community in NYC

Thanks to the contributions of our sponsors and participants, Additive Manufacturing Strategies (AMS) 2023 will feature some truly fun and novel networking activities in New York, February 7 – 9,...