With decades of experience dealing with the global electronics manufacturing industry, Israel-based technology and solutions provider Orbotech has become an integral part of the electronics 3D printing movement, an expansively growing and increasingly vital industry. A couple of months ago, Orbotech unveiled their Precise 800 Automated Optical Shaping (AOS) System at the Suzhou, China-based exhibition CTEX 2016. This system will aim to conquer advanced high density interconnect (HDI) and complex multi-layer PCB manufacturing, using their proprietary technology to offer this unique solution.
Now, it seems like major enterprises are starting to take notice of what companies like Orbotech have to offer. Recently, Amkor Technology, Inc., a leading provider of semiconductor packaging and test services based in Tempe, Arizona, decided that they would begin utilizing the Orbotech Inkjet 600 3D printing system to print high aspect ratio, 3D underfill dams for new system-in-package (SiP) products. SiP corresponds to the number of integrated circuits enclosed in a single module, and by laying out this electronic groundwork via 3D printing technology, components can be mapped in an extremely compact way.
“Amkor’s use of Orbotech Inkjet 600 for 3D printing is a significant implementation of process innovation in high-volume semiconductor packaging. We are experiencing a great deal of interest in inkjet printing from the packaging industry, for applications ranging from underfill dams to package marking to the direct printing of isolation layers. We believe that this may be the beginning of an industry trend towards adopting additive manufacturing solutions for seamless production processes,” said Kevin Crofton, President of SPTS and Corporate Vice President at Orbotech.
By integrating Orbotech’s technology into their business model, Amkor hopes to maximize its manufacturing flexibility, increase its feature position accuracy, and also reduce its design-to-manufacturing lifecycle. By utilizing the Inkjet 600 3D printer to create underfill dams, which are used prevent leakage between active and passive components, Amkor hopes to enable the formation of tall underfill dams in one single process. In order to implement a tighter integration of components, the company will use Orbotech’s technology for real-time local alignment correction, ensuring that every component is ideally situated.
“Amkor’s emphasis is on functional integration and size reduction by using different package and interconnect technologies for System-in-Package offerings. By investing in solutions such as Orbotech Inkjet 600 for printing of underfill dams as opposed to conventional methods, we enable higher levels of integration in smaller form factors for our customers,” commented Amkor’s R&D Vice President in South Korea, JuHoon Yoon.
Not only will the Orbotech Inkjet 600 cut production time by eliminating the need for subtractive manufacturing process, it will also help Amkor drive down their production costs as well. This latest integration of electronics 3D printing by Amkor shows the undeniable rise of additive manufacturing as a tool for manufacturing electronic products. Orbotech will be exhibiting their technology alongside their subsidiary company, called SPTS Technologies, at SEMICON West, which takes place from July 12-14 in San Francisco. For those on the West Coast planning to attend the upcoming conference and exhibition, you can find Orbotech at Booth No. 1417 in the South Hall. Discuss further over in the Amkor to Begin Using Orbotech Inkjet 600 3D Printing System forum over at 3DPB.com.