We’ve got some partnership news we’re sharing in today’s 3D Printing News Briefs! Cetim and Desktop Metal are working together, while DOMO and Zare have also announced a partnership. Moving on, HENSOLDT and Nano Dimension have achieved a 3D-printed electronics breakthrough.
Cetim Partners with Desktop Metal
This week, Cetim, the Technical Centre for Mechanical Industry in France, and Desktop Metal announced that they are partnering to expedite global adoption of metal additive manufacturing. Cetim, which already installed the Desktop Metal Studio System into its Cluses facility, will become one of the first adopters of the new Desktop Metal Shop System, first introduced at formnext 2019. Framed as the first metal binder jet system in the world designed specifically for metal job shops and machine shops, the Shop System is meant to be a high-speed, cost-effective way for manufacturers to 3D print end-use metal parts with excellent print quality. Desktop Metal suggests that it helps companies find new ways to increase revenue and lower costs. Now Cetim, which works to facilitate technical progress and identify market opportunities with industrial companies in sectors ranging from aerospace and automotive to oil and gas, can look into more advanced manufacturing solutions.
“When it comes to empowering industrial companies with the additive manufacturing technologies of the future, Cetimis truly one of the leaders in Europe. We are excited to partner with Cetim as one of the first customers for our ground-breaking Shop System and are eager to collaborate with Cetimon our shared efforts to change the way that companies manufacture around the globe,” said Ric Fulop, Desktop Metal’s CEO and Co-Founder.
As part of the partnership, Cetim and Desktop Metal will also collaborate on several research initiatives together.
DOMO Chemicals and ZARE Announce Partnership
German SLS materials leader DOMO Chemicals is partnering with 3D-printed parts service bureau ZARE in order to strengthen Sinterline additive manufacturing. By working with the Italian company, DOMO will strengthen its position in the AM industry, so it can better support the consumer electronics and automotive industries as they move from prototyping to serial production and require more from 3D-printed parts makers. The partnership between the two will take advantage of the HUB by Sinterline platform, which supports customers from design and material selection all the way to parts testing. Additionally, by combining ZARE’s production capabilities with Sinterline Technyl PA6 powders, OEMs and Tier parts suppliers will have a good reference point.
“Newly-enhanced Sinterline Technyl PA6 6300HT powders feature easy processability, excellent mechanical performance, long life and a very high melting temperature. This PA6 powder grade can be widely used in applications where components are subject to wear or friction. With 25 industrial grade machines we cover all the additive manufacturing technologies. Sinterline products help us maintain perfect control of production processes and guarantee consistent and repeatable results in production,” said Giuseppe Pisciuneri, Sales Manager at ZARE.
HENSOLDT and Nano Dimension’s Electronics 3D Printing Breakthrough
Together with 3D-printed electronics leader Nano Dimension, German sensor solutions provider HENSOLDT has achieved a major breakthrough in using 3D printing to fabricate high-performance electronics components. HENSOLDT first began working with Nano Dimension’s DragonFly 3D printing system back in 2016, and last year implemented the Israeli company’s DragonFly Lights-Out Digital Manufacturing (LDM) printing technology. Now, it has assembled what it claims to be the world’s first ten-layer printed circuit board (PCB), using a newly developed dielectric polymer ink and Nano Dimension’s conductive ink. The new multi-layer PCB, which carries electronic structures soldered to the outer sides of the board, will help accelerate electronics rapid prototyping, particularly when it comes to military sensor solutions.
“Nano Dimension’s relationship with HENSOLDT is the type of partnership with customers we are striving for. Working together and learning from HENSOLDT led us to reach a first-of-its-kind in-depth knowledge of polymer materials applications,” stated Yoav Stern, Nano Dimension President and CEO. “Additionally, it guided us in the development of Hi-PEDs (High Performance Electronic Device) that create competitive edges by enabling unique implementations with shortest time to market.”
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