In today’s 3D Printing News Briefs, we’re talking about new products and materials, an industry event, 3D printed electronics, and education. 3Doodler announced a new product, and Essentium will be showcasing two new materials at RAPID + TCT. The 4th annual AM Cluster of Ohio conference is coming up in July, and nScrypt is microdispensing 50um dots for 3D printed electronics. Finally, Penn State University is investing in Roboze technology.
3Doodler Introduces New 3D Build & Play
“3D Build & Play brings the creative fun of our Start pen without the learning curve for the youngest users. The system we have developed, that lets kids crank and create in 3D, is a major benefit for parents looking to improve their children’s basic motor skills. The included molds make it easy to create 3D objects by simply filling and popping them out. There’s nothing on the market today that makes 3D creation this simple or fast for young creators,” said 3Doodler’s CEO Daniel Cowen.
Essentium’s New Materials for High-Temperature Applications
According to a survey commissioned by Essentium, 51% of executives believe that the high cost of materials is a major obstacle when it comes to adopting 3D printing for large-scale production purposes. The new ULTEM AM9085F and ABS materials were created to give manufacturers a more cost-effective solution when compared to expensive closed-system materials. Learn more at Essentium’s Booth #3400 at RAPID + TCT in Anaheim, CA, April 20-23, 2020.
4th Annual Additive Manufacturing Cluster of Ohio Conference
The website states, “The program will look at similarities and differences across several selected manufacturer types and will identify strategies ranging from low to high risk. Attendees will leave with actionable strategies and information about regional resources to help them remain competitive in the evolving manufacturing landscape.”
nScrypt Working with 3D Printed Electronics
These tests showed a consistent average dot diameter of 51.24 microns, with a 6.42 micron (13%) standard deviation. These results support the fabrication of 3D printed electronics through the use of direct digital manufacturing (DDM), which allows printing to both planar substrates and the non-planar world of Printed Circuit Structures, which prints the housing or structure of an electronic device as well as placing the electronics conformally. In the future, the team plans to conduct a larger solder and adhesive dot study, in order to test required downtime, long-term reliability, and the frequency of clogging.
Penn State University Invests in Roboze Technology
“ROBOZE One+400 Xtreme will be used to examine novel polymers to help to fundamentally understand the 3D printing process and as a tool to enable custom equipment more cost effectively than can be obtained with machining metals while also allowing for designs not possible with traditional manufacture. The ROBOZE One+400 Xtreme will allow Penn State to leverage its expertise in materials science, engineering and characterization to enable new solutions to problems through additive manufacturing,” said Professor Bryan D. Vogt from the Department of Chemical Engineering.
“The ability to use custom filaments and control the print processing was a critical factor in selecting ROBOZE. The flexibility allowed by ROBOZE along with its excellent printing capabilities is well aligned with the discovery-oriented research mission of the university to expand knowledge and its application. Moverover, our prior 3D printer had issues printing high temperature engineering plastics like PEEK with severe deformation of the structure generally observed. After challenges with printing PEEK with standard belt driven systems, the novel direct drive approach with the ROBOZE was an added bonus.”
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